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Executive Technical Program Committee

Azadeh Ansari
Georgia Tech
USA
Nuria Barniol
UAB
SPAIN
Philippe Basset
ESYCOM - Univ Gustave Eiffel
FRANCE
Pierre Blondy
XLIM
FRANCE

Cristian Cassella
Northeastern University
USA
Xiaodong Chen
Nanyang Technological University
SINGAPORE
Karen Cheung
University of British Columbia
CANADA
Hanna Cho
Ohio State University
USA
David Elata
Technion - Israel Institute of Technology
ISRAEL
Sam Emaminejad
University of California, Los Angeles
USA
Jaume Esteve
CSIC
SPAIN
Philip Feng
University of Florida
USA
Bonnie Gray
Simon Fraser University
CANADA

National Institute of Advanced Industrial Science and Technology
JAPAN
David Horsley
University of California, Davis
USA
Beomjoon Kim
The University of Tokyo
JAPAN
Eun Kim
University of Southern California
USA
Takeshi Kobayashi
National Institute of Advanced Industrial Science and Technology
JAPAN
Haluk Külah
METU
TURKEY
Franz Lärmer
Robert Bosch GmbH Germany
GERMANY
Hyunjoo Jenny Lee
KAIST
KOREA
Wen Li
Michigan State University
USA
Zhihong Li
Peking University
CHINA
Cheng-Yao Lo
National Tsing Hua University
TAIWAN
Regina Luttge
Eindhoven University of Technology
NETHERLANDS
Liviu NICU
CNRS
FRANCE
Stella Pang
City University of Hong Kong
HONG KONG
Jungyul Park
Sogang University
KOREA
Hoang-Phuong Phan
Griffith University
AUSTRALIA
Niels Quack
EPFL
SWITZERLAND
Swaminathan Rajaraman
University of Central Florida
USA
Carolyn Ren
University of Waterloo
CANADA
Robert "Chris" Roberts
University of Texas, El Paso
USA

Niclas Roxhed
KTH Royal Institute of Technology
SWEDEN
Francesca Santoro
Italian Institute of Technology
ITALY
Silvan Schmid
TU Wien
AUSTRIA
Chander Shekhar Sharma
Indian Institute of Technology, Ropar
INDIA
Shuji Tanaka
Tohoku University
JAPAN
Tiger Tao
Shanghai Institute of Microsystem and Information Technology, CAS
CHINA
Sten Vollebregt
Delft University of Technology
NETHERLANDS
Zheyao Wang
Tsinghua University
CHINA

University of Electronic Science and Technology of China
CHINA
Dana Weinstein
Purdue university
USA
Peter Woias
Albert-Ludwig-University Freiburg
GERMANY
Euisik Yoon
University of Michigan
USA
Valentina Zega
Politecnico di Milano
ITALY
Haixia Zhang
Peking University
CHINA
Jie Zou
Qualcomm
USA